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Chapter F: Multi Chip Modules
F3. Level 3. Background information Print this information in .pdf format by clicking the link [1] "Electronic Components, Packaging and Production" ISBN:82-992193-2-9, by Leif Halbo and Per Øhlckers[2] "Electronic Materials Handbook, Volume 1 Packaging", ASME International, 1989 [3] "Plastics for Electronics", M. T. Goosey, Elsevier Applied Science Publishers, 1985 [4] "Chip on Board Technologies for Multi Chip Modules", J. H. Lau, Van Nostrand Reinhold, 1994 [5] "Introduction to Multi Chip Modules", N. Sherwani, Q. Yu and S. Badida, John Wiley & Sons, 1995
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