F: Background
F: Introduction F: Guidelines F: Background F: References

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Chapter F: Multi Chip Modules

F3. Level 3. Background information

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[1] "Electronic Components, Packaging and Production" ISBN:82-992193-2-9, by Leif Halbo and Per Øhlckers

[2] "Electronic Materials Handbook, Volume 1 Packaging", ASME International, 1989

[3] "Plastics for Electronics", M. T. Goosey, Elsevier Applied Science Publishers, 1985

[4] "Chip on Board Technologies for Multi Chip Modules", J. H. Lau, Van Nostrand Reinhold, 1994

[5] "Introduction to Multi Chip Modules", N. Sherwani, Q. Yu and S. Badida, John Wiley & Sons, 1995

 

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