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Chapter F: Multi Chip Modules
by Torstein Gleditsch, Helge Kristiansen and Dag Ausen
LIST OF CONTENTS
F1. Level
1. Introduction to Multi Chip Module technology
F1.1 What is Multi Chip
Modules
F1.2 MCM marked forecast
F1.3 Choice of right technology
F1.3.1 MCMs vs.
ASICs
F1.3.2 High
frequency
F1.3.3 Thermal
properties
F1.3.4
Miniaturisation
F1.3.5 Cost
F1.4 Substrate Technology
overview
F1.4.1 MCM-L
F1.4.2 MCM C
F1.4.3 MCM D
F1.5 Module Assembly Techniques
F1.5.1 Wire Bond
F1.5.2 Tape
Automated Bonding (TAB)
F1.5.3 Flip-Chip
(FC)
F1.6 Module Encapsulation
Techniques
F1.6.1 Dam
Moulding
F1.6.2 Transfer
Moulding
F1.6.3 Hermetic
Casing
F1.7 Testing issues
F1.7.1 Boundary
scan
F1.7.2 Built-In
Self Test (BIST)
F1.8 Acronym list
F2. Level
2. Conclusions / Guidelines
F2.1 MCM L
F2.1.1 Sequential Build
Up Process
F2.1.2 Wire bonding on
SBU
F2.1.3 Dielectrics for
SBU
F2.1.4 Examples
F2.1.5 Future Directions
of MCM-L
F2.1.6 MCM Flex
F2.2 MCM C
F2.2.1 Thick Film
Substrates
F2.2.2 High Temperature
Cofired Ceramics LTCC
F2.2.3 Low Temperature
Cofired Ceramics LTCC
F2.3 MCM D
F2.3.1 Thin Film
Technology
F2.3.2 Alternative
techniques (substrates)
F2.4 IBM’s Thin-film on ceramic
F2.4.1 Properties of
IBM’s glass ceramic multilayer
F2.4.2 Properties of
IBM’s multilayer thin film
F2.4.3 IBM’s G5 MCM
F3. Level
3. Background Information
F4. Level 4.
References
F4.1 Recommended reading
F4.2 General references
F4.3 Table index
F4.4 Figure index
  
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