F: Multichip Module
A: Wire Bonding B: Flip Chip C: Polymer Bonding D:Chip Scale Pack. E: Ball Grid Array F: Multichip Module Search Page Comments Page

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F: Introduction
F: Guidelines
F: Background
F: References

Chapter F: Multi Chip Modules

by Torstein Gleditsch, Helge Kristiansen and Dag Ausen

LIST OF CONTENTS

F1. Level 1. Introduction to Multi Chip Module technology

F1.1 What is Multi Chip Modules

F1.2 MCM marked forecast

F1.3 Choice of right technology

F1.3.1 MCMs vs. ASICs

F1.3.2 High frequency

F1.3.3 Thermal properties

F1.3.4 Miniaturisation

F1.3.5 Cost

F1.4 Substrate Technology overview

F1.4.1 MCM-L

F1.4.2 MCM C

F1.4.3 MCM D

F1.5 Module Assembly Techniques

F1.5.1 Wire Bond

F1.5.2 Tape Automated Bonding (TAB)

F1.5.3 Flip-Chip (FC)

F1.6 Module Encapsulation Techniques

F1.6.1 Dam Moulding

F1.6.2 Transfer Moulding

F1.6.3 Hermetic Casing

F1.7 Testing issues

F1.7.1 Boundary scan

F1.7.2 Built-In Self Test (BIST)

F1.8 Acronym list

F2. Level 2. Conclusions / Guidelines

F2.1 MCM L

F2.1.1 Sequential Build Up Process

F2.1.2 Wire bonding on SBU

F2.1.3 Dielectrics for SBU

F2.1.4 Examples

F2.1.5 Future Directions of MCM-L

F2.1.6 MCM Flex

F2.2 MCM C

F2.2.1 Thick Film Substrates

F2.2.2 High Temperature Cofired Ceramics LTCC

F2.2.3 Low Temperature Cofired Ceramics LTCC

F2.3 MCM D

F2.3.1 Thin Film Technology

F2.3.2 Alternative techniques (substrates)

F2.4 IBM’s Thin-film on ceramic

F2.4.1 Properties of IBM’s glass ceramic multilayer

F2.4.2 Properties of IBM’s multilayer thin film

F2.4.3 IBM’s G5 MCM

F3. Level 3.  Background Information

F4. Level 4. References

F4.1 Recommended reading

F4.2 General references

F4.3 Table index

F4.4 Figure index

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