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Chapter E: Ball Grid Array Technology
by Roger Rörgren
LIST OF CONTENTS
E1. Level 1.
Overview of the BGA Technology
E1.1 Introduction
to BGA Technology
E1.1.1 BGA
History
E1.1.2 Common
BGA packages
E1.1.3
Driving Forces for using BGAs
E1.1.4
Advantages and disadvantages using BGAs
E1.1.5
Standards and Common Practice
E1.1.6 Price
versus Performance
E2. Level 2.
Conclusions and Guidelines
E2.1 Technical
Issues
E2.1.1 Basic
properties of BGA packages
E2.1.2
Electrical performance
E2.1.3
Thermal performance (heat dissipation and cooling techniques)
E2.1.4
Reliability issues
E2.2 Production
Issues
E2.2.1 Design
rules and compatibility
E2.2.2 Tools
and investments
E2.2.3
Assembly issues
E2.2.4
Inspection and Workmanship Standards
E2.2.5 Rework
and Repair
E3. Level 3.
Background Information (Links)
E3.1 Reports
E3.2 Papers
E4. Level 4.
References
E4.1 Recommended
reading
E4.2 Reports
E4.3 Papers
E4.4 Conferences
  
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