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[C1] Harry, K. "Organic solder - a new type of adhesive/conductor for electronics". 1st International SAMPE electronics conference - Electronic materials and processes, pp. 168-179 1987

[C2] Estes, R.h, Kulesza, F.W. "Surface mount technology - the epoxyalternative proceedings" NEPCON West, 1984 pp. 219-234

[C3] Burkhart, A.; Yoshigahara, H.; Sagami, Y; Yamazaki, T. "Conductive polymeric adhesives solve SMD assembly problems" Adhesive age Oct. 1990, p. 36-39

[C4] Smith-Vago, L. "Adhesives that possess a science all their own" Electronic packaging & production, Aug. 1985 p. 48.50

[C5] Harry, A. King "Organic solder, chemistry takes the heat off the soldering process" Circuits manufacturing 33 Nov. 1987 pp. 33-36

[C6] Bolger, Justine C., Morano, Silvio L. "Conductive adhesives: How and where they work" Adhesive Age June 1984, pp. 17-20

[C7] Small, Charles H. "Adhesives spread to all phases of electronics" EDN July 21, pp. 74-82 1988

[C8] Murray, Bruce "Choosing the right surface-mount adhesive" Machine Design 56:89-93 Oct. 25 1984

[C9] Pandiri, Samir M. "The behaviour of silver flakes in conductive epoxy adhesives" Adhesives Age, Oct. 1987 pp. 31-35

[C10] Pound, Ronald "Conductive epoxy is tested for SMT solder replacement" Electronic packaging & production

[C11] Hof, Manfred "Klebetechniken in der Mikroelektronik" Polytec

[C12] Dorbath, B. og Mieskes, H.D. "Development and application of conductive adhesives for new interconnection technologies in electronics", Demetron, Preceedings from "Verbindungstechnik in der Elektronik/Interconnection technology in electronics" Feb. 1990 DVS 129

[C13] Bolger, Justine C., McGovern, James F. and Sylva John M. "Conductive epoxy surface mount adhesives for solder replacement" Emerson & Cumming Inc.

[C14a] Gilleo, Dr. K., Chu, Dr. A-l and Vieau, D. "High stability solderless junctions using advanced conductive adhesives" Proceedings from Nepcon west 1991. Feb. 24-28 1991

[C14b] Yoshigahara, H., Sagami, Y., Yamazki, T., Burkhart, A. and Edwards M. "Anisotropic adhesives for advanced surface mount interconnection" Proceedings from Nepcon west. Feb. 24-28 1991

[C14c] Yamagochi, Y. and Kato, M. "Some progress in anisotropic conductive film" Proceedings from Nepcon west 1991, Feb. 24-28 1991

[C14d] Jagt, J.C. "Adhesive concepts for the fisation of electronic components" Adhesion 90, conference 10-12 Sept. 1990 in Cambridge

[C16] Christiernin, G. "El-limping av komponenter pa kort snart i sikte" Modern Elektronik 3/91

[C17] Hennemann, O.-D, Mieskes, H., Dorbath, B. "Elektrisch leitendes Kleben in der Elektronik". (Conductive adhesive bonding in electronics) Proceedings from "Verbindungstechnik in der Elektronik/interconnection technology in electronics", Feb. 1990 DVS 129 pp. 47-30

[C18] Wipfelder, E.; Orthmann, K. "Elektrisch leitfahige Klebstoffe fur elektronische Bauelemente". Adhasion 1989 Hett 11 p. 26-30

[C19] Costlow, T. "Focus on conductive epoxies" Electronic design vol. 34, no. 11 May 1986 p. 181-6

[C20] Bourdelaise, R.A. "Solderless alternatives to surface mount component attachment" 4th International SAMPE Electronics Conference. vol. 4 electronic materials - our future. 1990 p1-10

[C21] E. Hansen, N.J. Busch "CFC forbrugsmønster i Danmark" Miljøprojekt nr. 92 1988, Miljøstyrelsen

[C24] Anonymous "Application of low silver loading conductive adhesives to surface mounting" Research Disclosure 1987, p. 566 vol 281

[C25] Brunner, H. "Leitklebstoffe - die sinnvolle Alternative" Adhasion Heft 10 (1987) p. 9

[C26] Ying, L. "A reworkable high reliability thermoplastic die attach adhesive" Proceedings international symposium on microelectronics 1986, p. 621-631

[C27] Mims, Forrest M. "Conductive inks and adhesives" Radio-Electronics 1987, Nov. pp. 81-84

[C28] Spitz, S. Leonard "Conductive polymers come out from labs" Electronic packaging & production

[C29] Dassele, Michael A. "EPO-TEK H20E conductive epoxy: the effects of mix ratio and pot age on electrical and mechanical performance"

[C30] Epoxy Technology Inc. EPO-TEK 420E

[C31] Lambert, Francois "H20 E Mixing ratio influence on over-all performances" Epotency France 1987/mge microtech ate.

[C32] Whiting, T., Tuffee, J. "The fabrication of silver flakes for use in MLCC termination inks" A study of flake parameters and their effect on the properties of these inks. CARTS-EUROPE '91. 5th European Capacitor and Resistor technology symposium. P. 42-53

[C33] Baumann, L. "Anwendung leitfahiger Polymere zur SMD-Kontaktierung auf Polymerleiterplatten" Feingeratetechnik 38 1989 p. 351-353

[C34] Estes, R.H. "Adhesives for microelectronics MIL-A-87172 & beyond" Proceedings International Symposium on Microelectronics 1986 p. 642-656

[C35] Moshammer, A., Wippel, Th., Zettl, F. Ceramic chip capacitor for conductive bonding" CARTS-EUROPE'91. 5th European capacitor and resistor technology symposium. P. 255-260

[C36] Moshammer, A. "Um Faktor 2 besser, Warum sich keramische Chipkondensatoren fur die Leitklebetechnik eignen" Leitklebetechnik, PRONIC 21 Feb. 1991

[C37] Nowak Artur Overheads from meeting at EC 1991

[C38] Fulton, J.A., Moore, R.C., Sekutowski, J.C. "Use of anisotropically conductive polymeres in electronic applications". 3rd International SAMPE Electronics Conference 1989 p. 578-589

[C39] Estes, R.H.; Kulesza, F.W. "Conductive epoxy solves surface mount problems". Packaging and Interconnections Electronic Products magazine March 5, 1984 [C40] Sharpe, C. "Advanced materials technology - the linchpin of electronics" Electronics & Power, vol. 32 no. 10 oct. 1986 p. 747-750

[C41] Yoshigahara, H.; Sagami, Y.; Nose, S.; Burkhart, A. "Conductive epoxies for attachment of surface mount devices" 4th International SAMPE Electronics Conference. Vol 4 Electronic materials - our future. June 12-14, 1990

[C42] Li, Lin and Chung, D.D.L "Electrically conducting powder filled polyimidesiloxane" 4th International SAMPE Electronics Conference, June 12-14, 1990

[C46] Claes von Schéele "Ledande lim - Ett Alternativ till lod" IVF Jan. 86 (In Swedish)

[C47] Schafer, H.; Gesang, Th.; Hennemann, O.D.; Van Eys, H. "AEM-Untersuchungen an Grenzschichten in elektrisch leitfahigen Klebverbindungen" DVS Berichte Band 141 Verbindungstechnik in der Elektronik Vortrage und Poster-Beitrage des 6. Internationalen Kolloquiums in Fellbach vom 18. Bis 20. Feb. 1992

[C48] Burmester, K. "Vorbereitung und Nachbearbeitung von Lot- und Klebstellen in elektronischen Baugruppen" DVS Berichte Bank 141 Verbindungstechnik in der Elektronik. Vortrage und Poster - Beitrage des 6. Internationalen Kolloquiums in Fellbach vom 18. Bis 20. Feb. 1992

[C49] Liu, J. "Bonding of fine pitch SMD using anisotropic conductive adhesives" Seminar: Conductive Adhesives 19th March 1992 at ElektronikCentralen

[C50] Rikola, R. "Reliability of joints made with Conductive Adhesives" Technical Research Centre of Finland. Seminar: Conductive Adhesives 19th March 1992 at ElektronikCentralen

[C51] Gawalewicz, T.; MPE Microtech "One- and two-component epoxies, polyimides and silicones - +/-?" Seminar: Conductive adhesives 19th March 1992 at ElektronikCentralen

[C52] Van den Bosch, A. GRACE "Trends reliability and technical development for the use of conductive adhesives as solder replacement" Seminar: Conductive Adhesives 19th March 1992 at ElektronikCentralen

[C53] Lerche, A. "Lime til metal" (Adhesives for metal) - tekniske og miljømæssige egenskaber for en række limtyper Arbeidsmiljefondens forskningsrapporter

[C54] S.T. Olesen "CFC Reduction" ECR-250, April 1992

[C55] Henrik L. Hvims "Electrically Conductive Adhesives for SMT, Reliability, design guidelines and applications for solder replacement" July 1993, EC-report

[C56] Henrik L. Hvims "Adhesives as Solder Replacement for SMT, Reliability, design guidelines, applications and materials guide for electrically conductive adhesives" January 1994, volume 1 and 2

[C57] IPC-3406 "Guidelines for Electrically Conductive Surface Mount A Adhesives", July 1996

[C58] James C. Jagt "Reliability of Electrically Conductive Adhesive Joints for Surface Mount Applications, A Summary of the State of the Art"