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Chapter B: Flip-Chip Technology B3. Level 3. Background information Print this information in .pdf format by clicking the link Technical paper library (http://www.flipchip.com/flipsec4/library.htm) "Reliability of Fine Pitch Solder Bump Flip-Chip-on-Flex: Design and Assembly Techniques, Part 1" by Deborah Patterson, Richard Moraca, Hong Yang, Kate Medlock, Hazel Schofield, Martin Christie, Tony Cowburn and Colin Thompson, GlobalTRONICS 1998, Singapore, October 5-9, 1998. "Flex-On-Cap Solder Bump for Manufacturability and High Reliability" by Thomas Goodman and Peter Elenius, IMAPS Nordic ´98, Stockholm, September 20-23, 1998. "Wafer Bumping Technologies – A Comparitive Analysis for Solder Deposition Processes and Assembly Considerations" by Deborah S. Patterson, Peter Elenius, James A. Leal, INTERPack `97, June 15-19, 1997, EEP-Vol. 19-1, Advances in Electronic Packaging – 1997, ASME 1997, pp. 337-351. "Flip chip bumping for IC Packaging Contractors" by Peter Elenius, March 1998. "The Economies of Bump & Flip" by Jack Bogdanski, August 1997.
Bumping Service Design Guide of Flip Chip Technologies : http://www.flipchip.com Known good die including flip chip literature: http://www.imec.be/kgd/
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