B: Flip Chip
A: Wire Bonding B: Flip Chip C: Polymer Bonding D:Chip Scale Pack. E: Ball Grid Array F: Multichip Module Search Page Comments Page

B: Introduction
B: Guidelines
B: Background
B: References

Chapter B: Flip-Chip Technology

by Jouko Vähäkangas, Outi Rusanen, Tuomo Jaakola and Jaakko Lenkkeri


B1. Level 1. Introduction to Flip-Chip techniques

B1.1 Why flip-chip?

B1.2 General benefits/disadvantages

B1.3 Relative cost comparison

B1.4 Availability of components

B1.5 How mature is the technology?

B1.6 Short description of each flip chip process

B1.6.1 Flip chip process by solder joining.

B1.6.2 Flip chip joining by thermocompression.

B1.6.3 Flip chip thermosonic joining

B1.6.4 Flip chip joining using adhesives (isotropic, anisotropic, nonconductive)

B1.7 Reliability

B1.8 Testing

B2. Level 2. Guidelines

B2.1 Flip Chip Bonding using soldering process

B2.1.1 Design issues

B2.1.2 Production issues (tools needed, investments, price/performance, training requirements)

B2.2 Flip Chip Bonding using thermocompression

B2.2.1 Design issues

B2.2.2 Production issues

B2.3 Flip chip bonding using thermosonic method

B2.3.1 Design issues

B2.3.2 Production issues

B2.4 Flip chip joining using adhesives

B2.4.1 Design issues

B2.4.2 Production issues

B2.5 Environmental issues

B3. Level 3. Background information

B3.2 Papers

B3.3 Other links

B4. Level 4. References

B4.1 Recommended reading

B4.2 Flip Chip literature

B4.3 List of key conferences

B4.4 Standards

B4.5 General references

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