A: Background
A: Introduction A: Guidelines A: Background A: References

Home
Up

Chapter A: Wire Bonding

A3. Level 3. Background information

Click on a reference to open it in Adobe Portable Document Format (.pdf). If you don't have the Adobe Acrobat Reader installed on your computer, you can get it free of charge from Adobe Systems by following the link below

http://www.adobe.com/prodindex/acrobat/readstep.html.

1. Zonghe Lai and Johan Liu, "Effect of the microstructure of Ni/Au metallization on bondability of FR-4 substrate."

 

Back Home Up Next