by Zonghe Lai and Johan Liu
LIST OF CONTENTS
A1.1 What is wirebonding A1.1.1 Wirebonding processes A1.1.2 Wirebond forms A1.3 History and applications A1.4 Cost A1.5 Limitation of wirebonding
A1.1 What is wirebonding
A1.1.1 Wirebonding processes
A1.1.2 Wirebond forms
A1.3 History and applications
A1.4 Cost
A1.5 Limitation of wirebonding
A2. Level 2. Conclusions and guidelines
A2.1 Wirebonding techniques A2.1.1 Ball bonding A2.1.2 Wedge bonding A2.2 Wires and typical metallurgical systems A2.2.1 Wires usually used in wirebonding A2.2.2 Metallurgical systems A2.3 Bonding equipment A2.3.1 Wirebonder A2.3.2 Bonding tools A2.4 Wirebonding guideline A2.4.1 Process optimization A2.4.2 Wirebonding design A2.4.3 Bond evaluation A2.5 Failure mechanisms of wirebonds A2.5.1 Failure shooting A2.5.2 Pad cleanliness A2.5.3 Bonding failures A2.5.4 Reliability failures
A2.1 Wirebonding techniques
A2.1.1 Ball bonding
A2.1.2 Wedge bonding
A2.2 Wires and typical metallurgical systems
A2.2.1 Wires usually used in wirebonding
A2.2.2 Metallurgical systems
A2.3 Bonding equipment
A2.3.1 Wirebonder
A2.3.2 Bonding tools
A2.4 Wirebonding guideline
A2.4.1 Process optimization
A2.4.2 Wirebonding design
A2.4.3 Bond evaluation
A2.5 Failure mechanisms of wirebonds
A2.5.1 Failure shooting
A2.5.2 Pad cleanliness
A2.5.3 Bonding failures
A2.5.4 Reliability failures
A3. Level 3. Background information
A3.1 Report A3.2 Publication
A3.1 Report
A3.2 Publication
A4. Level 4. References
A4.1 Recommended reading
A4.2 General references
