A: Wire Bonding
B: Flip Chip
C: Polymer Bonding
D:Chip Scale Pack.
E: Ball Grid Array
F: Multichip Module
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The Nordic Electronics Packaging Guideline

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A Nordic decision support guideline for the right selection of microelectronics packaging and interconnection systems

Guideline rationale

Project partners

Guideline structure


The guideline was developed by:

DELTA, Danish Electronics, Lights & Acoustics, http://www.delta.dk

IVF, The Swedish Institute of Production Engineering Research, http://www.ivf.se

SINTEF, Norway, http://www.sintef.no

VTT, Technical Research Center of Finland, http://www.ele.vtt.fi

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with support from the Nordic Industrial Fund

Guideline rationale

A number of national and Nordic microelectronics projects have been carried out to investigate mainly the technical performance of different packaging and interconnection systems. These projects have resulted in a very deep technical knowledge within different packaging techniques. There is, however, no comparative knowledge available from any of these sources.

Tomorrow's products will be required to meet even tougher standards in terms of economy, performance, reliability and size. It is therefore of the utmost importance to the users to get an overview of the available techniques and their advantages and disadvantages.

The selection of advanced packaging and interconnection techniques is a very complex task for the designer and manufacturing engineer. The guideline is intended to help the designer to make better decisions. This means that the guideline is a decision support system for the designer and not a tool giving only one right answer to a problem.

Comprehensive knowledge generated within the last five years within electronic packaging and interconnection programmes in the Nordic countries is gathered in this Nordic guideline. So far there has been no comparative knowledge available from any of these sources. The guideline groups this tremendous knowledge and makes it available on www as a service to the Nordic electronics industry. The guideline discuss the design, assembly, manufacturing, test, and quality aspects of these interconnect methods; review equipment, costs, specifications, and the applications that use these technologies. A paper version is generated for awareness and training courses. Please contact the project co-ordinator mailto:technoconsult@technodata.dk if you want a copy of the paper version

The guideline is recommended for manufacturing, quality and packaging engineers in integrated circuit, equipment and system design who need to solve the next-generation packaging problems. Also technical managers and individuals who provide materials and equipment, or contract-manufacturing services to the electronics industry will benefit from the guideline.

The guideline will make it possible for the designer to understand the advantages and disadvantages of different packaging and interconnection techniques; i.e. determine which products and systems to benefit from the said techniques.

Project partners

The project was carried out by representatives from four Nordic research institutes, namely:

Torstein Gleditch, SINTEF, Norway
Henrik Hvims, DELTA, Danish Electronics, Light & Acoustics
Roger Rörgren,  IVF, The Swedish Institute of Production Engineering Research
Jouko Vähäkangas, VTT Electronics, Finland

The project partners were supported by the following industrial experts who attended the project's Advisory Board:

Benjamin Baraas, Tandberg Data Storage A/S, Norway
Jan-Erik Bergman, Ericsson Telecom AB, Sweden
Rolf Dagborn, Victor Hasselblad AB, Sweden
Eero Järvinen, Picopak Oy, Finland
Terho Kutilainen, Aspocomp Oy, Finland
Jan Einar Nornes, Vestfold Engineering AS, Norway
Søren Nørlyng, MICRONSULT, Denmark
Søren Uhrenholt, Danfoss A/S, Denmark

Project initiation and co-ordination was done by:

Ivan Ring Nielsen, Technoconsult, Denmark


Guideline structure

The decision support guideline is organised as a matrix, in the following way:


The electronic version is organised in four levels:

1st level: Introduction
2nd level: Guidelines
3rd level: Background information
4th level: References

The idea is that the user starts at the introductory level in order to survey the various variants and applications of the particular technique. At the second level the user will be presented to the actual conclusions and possible guidelines. This will help the user to survey several solutions and make fast decisions. Only if the user wants to know more details about the said technique he will move to level three. This level will include detailed background information and complete surveys originating from R&D projects carried out at the research institutes involved. Finally the user will at level four get references to other research reports and surveys made by international technology consultants.

Please, click on any of the links below to go directly to the different chapters.

A: Wire Bonding ] B: Flip Chip ] C: Polymer Bonding ] D:Chip Scale Pack. ] E: Ball Grid Array ] F: Multichip Module ] Search Page ] Comments Page ]


You may also print each chapter in Adobe Acrobat 3.0 Portable Document Format (.pdf) by clicking on the links:

Wire Bonding    Flip Chip    Polymer Bonding    Chip Scale Packaging    Ball Grid Array     Multichip Modules

If you don't have the Adobe Acrobat Reader installed on your computer, you can get it free of charge from Adobe Systems.

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